mpxc2011dt1 rev 9, 10/2012 freescale semiconductor data sheet: technical data ? 2006, 2008-2010, 2012 freescale semiconductor, inc. all rights reserved. pressure high volume sensor for low pressure applications freescale semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. the unique concept of the chip pak allows great flexibility in system design while allowing an economic solution for the designer. this new chip carrier package uses freescale semiconductor's unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration. note: freescale semiconductor is also offering the chip pak package in application-specific configurations, which wil l have an ?spx? prefix, followed by a four-digit number, unique to the specific customer features ? low cost ? integrated temperature compensation and calibration ? ratiometric to supply voltage ? polysulfone case material (iso 10993) ? provided in easy-to-use tape and reel note: the die and wire bonds are exposed on the front side of the chip pak (pressure is applied to the backside of the device). front side die and wire protection must be provided in th e customer's housing. use caution when handling the devices during all processes. ordering information device name package options case no. pressure type device marking gauge differential absolute mpxc2011dti tape and reel 423a ? date code, lot id mpxc2011dt1 pressure sensors 0 to 75 mmhg (0 to 10 kpa) chip pak package mpxc2011dt1 case 423a-03 application examples ? respiratory diagnostics ? air movement control ? controllers ? pressure switching
mpxc2011dt1 sensors 2 freescale semiconductor, inc. pressure freescale semiconductor' s mpxc2011dt1 pressure sensor has been designed for medical usage by combining the performance of freescale semiconductor's shear stress pressure sensor design and the use of biomedically approved materials. materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. it can be sterilized using ethylene oxide. the portions of the pre ssure sensor that are required to be biomedically approved are the rigid housing and the gel coating. the rigid housing is molded from a white, medical grade polysulfone that has passed ex tensive biological testing including: 10993-5:1999, 10993-10:2002, and 10993- 11:1993. the mpxc2011dt1 contains a silicone dielectric gel which covers the silicon piezor esistive sensing element. the gel is a nontoxic, nonallergenic elastomer system which meets all usp xx biological testing class v requirements. the properties of the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. the gel provides electrical isolation sufficient to withstand defibrillation testing, as specified in the proposed associ ation for the advancement of medical instrumentation (aami) standard for blood pressure transducers. a biomedically approved opaque filler in the gel prevents bright operating ro om lights from affecting the performance of the sensor.
mpxc2011dt1 sensors freescale semiconductor, inc. 3 pressure maximum ratings operating characteristics table 1. maximum ratings (1) 1. exposure beyond the specified limits may c ause permanent damage or degradation to the device. rating symbol value unit maximum pressure (backside) p max 75 kpa storage temperature t stg -25 to +85 ? c operating temperature t a +15 to +40 ? c table 2. operating characteristics (v s = 10 vdc, t a = 25 ? c unless otherwise noted, p1 > p2) characteristic symbol min typ max unit pressure range (1) p op 0?1 0k p a supply voltage (2) v s ?31 0v d c supply current i o ?6.0?madc full scale span (3) v fss 24 25 26 mv offset (4) v off -1.0 ? 1.0 mv sensitivity ? v/ ? p? 2.5 ?mv/kpa linearity (5) ? -1.0 ? 1.0 %v fss pressure hysteresis (5) (0 to 10 kpa) ?? ? 0.1 ? %v fss temperature hysteresis (5) (+15? c to +40 ? c) ?? ? 0.1 ? %v fss temperature effect on full scale span (5) tcv fss -1.0 ? 1.0 %v fss temperature effect on offset (5) tcv off -1.0 ? 1.0 mv input impedance z in 1300 ? 2550 ? output impedance z out 1400 ? 3000 ? response time (6) (10% to 90%) t r ?1.0?ms warm-up ? ? 20 v ms offset stability (7) ?? ? 0.5 ? %v fss 1. 1.0 kpa (kilopascal) equals 0.145 psi. 2. device is ratiometric within this specified excitation range. operating the device above th e specified excitation range may i nduce additional error due to device self-heating. 3. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. offset (v off ) is defined as the output voltage at the minimum rated pressure. 5. accuracy (error budget) consists of the following: linearity: output deviation from a straig ht line relationship with pressure, using end point method, over the specified pressure range. temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cyc led to and from the minimum or maximum operating temperatur e points, with zero differential pressure applied. pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 ? c. tcspan: output deviation at full rated pressure over the temperature range of 0 to 85 ? c, relative to 25 ? c. tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 ? c, relative to 25 ? c. 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 7. offset stability is the product's output deviation when subjec ted to 1000 hours of pulsed pressure, temperature cycling with bias test.
mpxc2011dt1 sensors 4 freescale semiconductor, inc. pressure package dimensions case 423a-03 issue c chip pak package dim a min max min max millimeters 6.10 6.60 0.240 0.260 inches b 8.89 9.40 0.350 0.370 c 3.56 3.81 0.140 0.150 d1 0.30 0.51 0.012 0.020 e 2.24 2.59 0.088 0.102 f 3.12 3.25 0.123 0.128 g 1.14 1.40 0.045 0.055 h 0.94 1.19 0.037 0.047 j 0.18 0.28 0.007 0.011 k 3.05 3.56 0.120 0.140 l 2.41 2.67 0.095 0.105 m 4.19 4.45 0.165 0.175 n 5.66 6.07 0.223 0.239 v 2.67 2.92 0.105 0.115 aa 2.41 2.72 0.095 0.107 ab 0.38 0.89 0.015 0.035 ac 3.05 4.45 0.120 0.175 ad 2.54 2.92 0.100 0.115 notes: 3. dimensioning and tolerancing per ansi y14.5m, 1982. 4. controlling dimension: inch. style 1: pin 1. v cc 2. +out 3. ?out 4. ground ab ad aa f ac back view g d1 v n front view m a 12 4 3 c l b f k h e j ?t? end view d2 detail a detail a d2 0.36 0.56 0.014 0.022 style 2: pin 1. gnd 2. s+ 3. vs 4. s- 1. 2.
mpxc2011dt1 sensors 5 freescale semiconductor, inc. pressure table 3. revision history revision number revision date description of changes 9 10/2012 ? deleted references to device number mpxc2012dt (a no-gel option) throughout the document
mpxc2011dt1 rev. 9 10/2012 information in this document is provided solely to enable system and software implementers to use freescale products. there are no express or implied copyright licenses granted hereunder to design or fabr icate any integrated circuits based on the information in this document. freescale reserves the right to make changes without further notice to any products herein. freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. all operating parameters, including ?typicals,? must be validated for each customer application by customer?s technical experts. freescale does not convey any license under its patent rights nor the rights of others. freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. freescale, the freescale logo, energy efficient solutions logo, are trademarks of freescale semiconductor, inc., reg. u.s. pat. & tm. off. xtrinsic is a trademark of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? 2012 freescale semiconductor, inc. how to reach us: home page: freescale.com web support: freescale.com/support
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